UEM Group Scholarship Programme is an annual programme that supports the nation's objectives of creating elite scholars and serves as a talent supply chain in developing future leaders for the country.
Overseas:

• Undergo a pre-university programme at Kolej Yayasan UEM (KYUEM) in Lembah Beringin, before furthering studies at a reputable university overseas, notably UK, US and Australia.

Local:
Undergraduate studies at:

• Universiti Teknologi Malaysia (UTM),
• Universiti Putra Malaysia (UPM),
• Universiti Kebangsaan Malaysia (UKM),
• Universiti Malaya (UM),
• Universiti Islam Antarabangsa Malaysia (UIAM),
• Universiti Sains Malaysia (USM),
• Universiti Utara Malaysia (UUM),
• Universiti Teknologi MARA (UiTM) - All Branches,
• Universiti Tenaga Nasional (UNITEN) and
• Multimedia University (MMU).
• Other will not be considered.

In nurturing our scholars, leadership training and development activities with job attachments within the UEM Group of Companies are provided throughout the programme and within the bonded period.

March 20, 2016

• All applicants must be Malaysian citizens. Proficient in English, hardworking, and possess positive personality traits. An outstanding extra-curricular record will be advantageous to your application.

Overseas Scholarship:

• Excellent academic track record in Form 4 & 5
• Obtained a minimum of 7As (A+/A's) in relevant subjects at the 2015 SPM examinations

Local Scholarship:

• STPM/Matriculation students in 2015, results announced recently, for university enrollment in September
• Obtained a minimum CGPA of 3.50

The scholarship covers academic expenses including:

• Tuition and examination fees,
• Air-fares (for overseas study),
• Insurance,
• Allowances for books, computer and subsistence.

• Business (Finance/Business Management/Accounting/Economics/Marketing)
• Built Environment (Quantity Surveying/Town Planning/Land Surveying/Building Services/Building Management)
• Engineering (Civil/Mechanical/Electrical)

• Visit the Official Scholarship website to check for the opening application dates as well as the release for the application form.